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| IPA60R299CP CoolMOSTM Power Transistor Features * Lowest figure-of-merit R ONxQg * Ultra low gate charge * Extreme dv/dt rated * High peak current capability * Qualified according to JEDEC1) for target applications * Pb-free lead plating; RoHS compliant Product Summary V DS @ Tj,max R DS(on),max Q g,typ 6.6 650 V 0.299 22 nC PG-TO220-3-31 CoolMOS CP is specially designed for: * Hard switching SMPS topologies Type IPA60R299CP Package PG-TO220-3-31 Ordering Code SP000096438 Marking 6R299P Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current 2) Symbol Conditions ID T C=25 C T C=100 C Pulsed drain current3) Avalanche energy, single pulse Avalanche energy, repetitive t AR3),4) Avalanche current, repetitive t AR3),4) MOSFET dv /dt ruggedness www..com Gate source voltage Value 11 7 34 290 0.44 4.4 Unit A I D,pulse E AS E AR I AR dv /dt V GS T C=25 C I D=4.4 A, V DD=50 V I D=4.4 A, V DD=50 V mJ A V/ns V V DS=0...480 V static AC (f >1 Hz) 50 20 30 33 -55 ... 150 Power dissipation Operating and storage temperature Mounting torque Rev. 1.3 P tot T j, T stg T C=25 C W C Ncm 2005-12-22 M2.5 screws page 1 50 IPA60R299CP Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous diode forward current 2) Diode pulse current 3) Reverse diode dv /dt 5) Symbol Conditions IS I S,pulse dv /dt T C=25 C Value 11 34 15 V/ns Unit A Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction ambient Soldering temperature, wavesoldering only allowed at leads R thJC R thJA T sold leaded 1.6 mm (0.063 in.) from case for 10 s 3.8 80 260 C K/W Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage V (BR)DSS V GS=0 V, I D=250 A V GS(th) V DS=V GS, I D=0,44 mA V DS=600 V, V GS=0 V, T j=25 C V DS=600 V, V GS=0 V, T j=150 C Gate-source leakage current Drain-source on-state resistance www..com 600 2.5 3 3.5 V Zero gate voltage drain current I DSS - - 1 A - 10 0.27 100 0.299 nA I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=6.6 A, T j=25 C V GS=10 V, I D=6.6 A, T j=150 C - 0.73 1.9 Gate resistance RG f =1 MHz, open drain Rev. 1.3 page 2 2005-12-22 IPA60R299CP Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Effective output capacitance, energy related6) Effective output capacitance, time related7) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current 1) Values typ. max. Unit C iss C oss C o(er) V GS=0 V, V DS=100 V, f =1 MHz - 1100 60 46 - pF V GS=0 V, V DS=0 V to 480 V C o(tr) t d(on) tr t d(off) tf V DD=400 V, V GS=10 V, I D=6,6 A, R G=4,3 - 120 10 5 40 5 ns Q gs Q gd Qg V plateau V DD=400 V, I D=6.6 A, V GS=0 to 10 V - 5 7.6 22 5.0 29 - nC V V SD t rr Q rr I rrm V GS=0 V, I F=6.6 A, T j=25 C - 0.9 300 3.9 26 1.2 - V ns C A V R=400 V, I F=I S, di F/dt =100 A/s - J-STD20 and JESD22 Limited only by maximum temperature Pulse width t p limited by T j,max Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f. ISD<=ID, di/dt<=200A/s, VDClink=400V, Vpeak www..com 3) 4) 5) 6) 7) Rev. 1.3 page 3 2005-12-22 IPA60R299CP 1 Power dissipation P tot=f(T C) 2 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p 35 102 limited by on-state resistance 30 10 s 1 s 25 10 1 P tot [W] 20 100 s I D [A] 1 ms 10 ms 15 100 10 DC 5 0 0 40 80 120 160 10-1 100 101 102 103 T C [C] V DS [V] 3 Max. transient thermal impedance Z thJC=f(t P) parameter: D=t p/T 101 4 Typ. output characteristics I D=f(V DS); T j=25 C parameter: V GS 45 10V 12 V 20 V 0.5 100 0.2 30 8V Z thJC [K/W] 0.1 0.05 I D [A] 6V 0.02 10-1 15 0.01 5.5 V www..com single pulse 5V 4.5 V 10-2 10-5 10-4 10-3 10-2 10-1 100 101 0 0 5 10 15 20 t p [s] V DS [V] Rev. 1.3 page 4 2005-12-22 IPA60R299CP 5 Typ. output characteristics I D=f(V DS); T j=150 C parameter: V GS 25 6 Typ. drain-source on-state resistance R DS(on)=f(I D); T j=150 C parameter: V GS 1.8 1.6 20 10 V 8V 20 V 12 V 6V 5V 5.5 V 6V 6.5 V 7V 1.4 1.2 10 V R DS(on) [] 5V 4.5 V 15 5.5 V I D [A] 1 0.8 0.6 0.4 0.2 10 5 0 0 5 10 15 20 0 0 5 10 15 20 25 V DS [V] I D [A] 7 Drain-source on-state resistance R DS(on)=f(T j); I D=6.6 A; V GS=10 V 8 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 0.8 50 40 0.6 C 25 R DS(on) [] 30 0.4 98 % typ I D [A] 20 C 150 www..com 0.2 10 0 -60 -20 20 60 100 140 180 0 0 2 4 6 8 10 T j [C] V GS [V] Rev. 1.3 page 5 2005-12-22 IPA60R299CP 9 Typ. gate charge V GS=f(Q gate); I D=6.6 A pulsed parameter: V DD 10 9 120 V 10 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 102 8 7 6 25 C, 98% 400 V 101 150 C 150 C, 98% 25 C V GS [V] 5 4 3 2 1 0 0 5 10 15 20 25 I F [A] 100 10-1 0 0.5 1 1.5 2 Q gate [nC] V SD [V] 11 Avalanche energy E AS=f(T j); I D=4.4 A; V DD=50 V 12 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=0.25 mA 300 700 660 200 V BR(DSS) [V] 100 0 20 60 100 140 180 E AS [mJ] 620 www..com 580 540 -60 -20 20 60 100 140 180 T j [C] T j [C] Rev. 1.3 page 6 2005-12-22 IPA60R299CP 13 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 14 Typ. Coss stored energy E oss= f(V DS) 105 8 104 6 Ciss 103 E oss [J] Coss Crss C [pF] 4 102 2 101 100 0 100 200 300 400 500 0 0 100 200 300 400 500 600 V DS [V] V DS [V] www..com Rev. 1.3 page 7 2005-12-22 IPA60R299CP Definition of diode switching characteristics www..com Rev. 1.3 page 8 2005-12-22 IPA60R299CP PG-TO220-3-31: Outline/ Fully isolated package (2500VAC; 1 minute) 6.6 Soldering temperature, wavesoldering only allowed at leads www..com Dimensions in mm/inches Rev. 1.3 page 9 2005-12-22 IPA60R299CP Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Strae 53 D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. www..com Rev. 1.3 page 10 2005-12-22 |
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